Top AMD Interview Questions & Answers

1. Introduction

In pursuit of a career with Advanced Micro Devices (AMD), a leading semiconductor company, it is essential to be well-prepared for the interview process. This article provides an extensive list of potential amd interview questions that candidates may encounter. Understanding the intricacies of these questions and mastering the art of articulating informed responses will set you apart as a promising contender for a position at AMD.

2. Unveiling the AMD Experience

When stepping into an interview with AMD, you’re not just demonstrating your expertise in technology but also aligning with the innovative spirit that propels the company. AMD is synonymous with cutting-edge semiconductor technology, driving innovation in high-performance computing, graphics, and visualization technologies. It’s a place where engineering acumen meets strategic foresight, making it imperative for candidates to showcase not only their technical capabilities but also their ability to contribute to AMD’s legacy of breakthroughs. For those eyeing roles that shape the future of computing, from design to implementation, understanding AMD’s commitment to advancing the industry is key to making a lasting impression.

3. AMD Interview Questions

Q1. Can you explain the difference between CPU and GPU architecture? (Computer Architecture)

The central processing unit (CPU) and graphics processing unit (GPU) are two critical components of modern computers with distinct architectural differences.

• CPU Architecture: The CPU is often referred to as the brain of the computer. It is designed to handle a wide range of computing tasks and is optimized for sequential processing. CPUs typically have a small number of cores, with lots of cache memory, capable of handling a few software threads at a time. They are designed for complex instructions and are capable of executing a series of operations to perform a task.

• GPU Architecture: On the other hand, GPUs were originally designed to render graphics and process large blocks of visual data simultaneously. They contain hundreds or thousands of smaller cores that are optimized for parallel processing. While each core is less powerful than a CPU core, collectively they can process large amounts of data simultaneously, making them very effective for algorithms that can be parallelized.

Here is a comparative table highlighting some key differences between CPU and GPU architectures:

Feature	CPU	GPU
Core Count	Fewer cores, but more complex	Hundreds to thousands of simpler cores
Task Handling	General-purpose, sequential tasks	Parallel processing of similar repetitive tasks
Memory	Larger cache memory	Smaller per-core cache, but higher overall bandwidth
Use Case	Diverse applications, including single-threaded tasks	Graphics rendering, scientific computations, AI workloads

Q2. Why are you interested in working at AMD? (Motivation & Company Fit)

How to Answer:
When answering this question, tailor your response to reflect your genuine interests and align them with AMD’s values, culture, and business direction. Include aspects like AMD’s innovation in the industry, the impact of its products, your passion for technology, and how the company’s goals resonate with your career aspirations.

My Answer:
I am deeply interested in working at AMD because I admire the company’s commitment to innovation and its position as a trailblazer in high-performance computing. AMD’s advancements in CPU and GPU technologies have not only fueled the growth of the tech industry but have also been vital in various sectors like gaming, data centers, and AI.

• Innovation: AMD’s Ryzen and EPYC series have set new standards in processing power, pushing the boundaries of what’s possible.
• Quality Products: The Radeon GPU lineup has been instrumental in advancing graphics technology.
• Industry Impact: AMD’s role in creating competitive markets ensures that consumers and businesses have access to cutting-edge technology.
• Company Culture: I resonate with AMD’s culture of openness and collaboration, and I look forward to contributing to a team that values creativity and pushing the envelope in technology.

Q3. Describe your experience with ASIC design flow. (ASIC Design)

My experience with ASIC (Application-Specific Integrated Circuit) design flow encompasses several stages, from initial specification to final verification and testing. Here are the key phases I have worked on:

1. Specification: Defining the functional requirements of the ASIC.
2. Architecture Design: Creating a high-level design of the ASIC’s architecture.
3. RTL Coding: Writing Register Transfer Level (RTL) code using hardware description languages like Verilog or VHDL.
4. Functional Verification: Verifying that the RTL code meets the specifications.
5. Synthesis: Translating the RTL into a gate-level netlist.
6. Place and Route: Arranging the synthesized netlist onto the silicon die and connecting elements with wiring.
7. Timing Analysis: Ensuring that the ASIC operates correctly at the desired clock speeds.
8. Physical Verification: Checking for design rule violations and ensuring manufacturability.
9. DFT: Designing for testability, including scan chain insertion and BIST (Built-In Self-Test) implementation.
10. Tapeout: Preparing the final design for manufacturing.
11. Post-Silicon Validation: Testing the manufactured ASIC for functionality and performance.

Throughout these stages, I have gained expertise in tools like Cadence, Synopsys, and Mentor Graphics, and have collaborated with cross-functional teams to ensure that the ASIC designs meet both technical and market requirements.

Q4. How would you optimize power consumption in a microprocessor? (Power Optimization)

Optimizing power consumption in a microprocessor is crucial for improving energy efficiency and thermal performance. Here are several strategies that can be employed:

• Dynamic Voltage and Frequency Scaling (DVFS): Adjusting the voltage and frequency based on workload demands to reduce power consumption.
• Power Gating: Turning off parts of the processor that are not in use to save power.
• Clock Gating: Disabling the clock signal to portions of the processor when they are idle to prevent unnecessary power usage.
• Multi-Vt Design: Using transistors with different threshold voltages to optimize for speed in critical paths and for power in non-critical paths.
• Leakage Power Reduction: Using techniques such as high-k metal gate transistors to reduce standby leakage power.
• Optimizing the Cache Hierarchy: Designing an efficient cache hierarchy to reduce the number of memory accesses, which can be power-intensive.

Additionally, to effectively optimize power consumption, a holistic approach that includes both hardware and software co-optimization is essential. This includes compiler optimizations, efficient operating system scheduling, and application-level power management.

Q5. What are the key factors that affect processor performance? (Processor Performance)

Several key factors affect processor performance:

• Clock Speed: The frequency at which the processor’s internal clock operates. Higher clock speeds can lead to faster execution of instructions.
• Core Count: The number of cores in the processor. More cores can improve performance in multi-threaded applications and multitasking environments.
• Cache Size: The amount of cache memory on the processor. Larger cache sizes reduce the need to fetch data from slower main memory, improving performance.
• Pipeline Depth: The number of pipeline stages in the CPU. A well-balanced pipeline can enhance instruction throughput.
• Instruction Set Architecture (ISA): The design of the processor’s instruction set can impact how efficiently it executes certain tasks.

Here’s a list of additional factors:

• Architecture improvements (IPC or Instructions Per Cycle)
• Memory bandwidth and latency
• Thermal Design Power (TDP) and cooling solutions
• Process technology (e.g., 7nm, 5nm manufacturing processes)

Understanding and optimizing these factors can lead to significant improvements in processor performance.

Q6. Explain a complex project you worked on and how you managed it. (Project Management)

How to Answer:
When answering this question, it’s essential to outline the scope of the project, the challenges faced, the team you worked with, the management strategies you employed, and the outcome. Use the STAR method (Situation, Task, Action, Result) to structure your response. Make sure to convey your leadership skills, organizational abilities, and technical expertise.

My Answer:
In my previous role, I managed a complex project aimed at developing a new integrated circuit design for low-power IoT devices.

• Situation: The project had a tight deadline of 10 months and required coordination between multiple teams across different geographic locations.
• Task: My role was to oversee the project’s progression, ensure communication between teams, and keep the project within budget and on schedule.
• Action: I started by creating a detailed project plan with clear milestones and deliverables. I conducted regular virtual stand-ups to keep teams aligned, used project management software to track progress, and implemented agile methodologies to adapt to changes quickly. Risk management was pivotal, so I identified potential issues early and devised mitigation strategies.
• Result: The project was a success, with the integrated circuit design being completed two weeks ahead of schedule and 5% under budget. It passed testing with fewer iterations than projected, and the design is now used in several popular IoT devices.

Q7. How do you stay updated with the latest trends in semiconductor technology? (Industry Knowledge)

• Subscribing to industry journals like IEEE Spectrum, Semiconductor Engineering, and Solid-State Technology.
• Attending conferences and webinars, such as the International Solid-State Circuits Conference (ISSCC) and SEMICON West.
• Participating in forums and online communities, e.g., Reddit’s r/ECE and r/hardware, and the SemiWiki Forum.
• Following leading companies and researchers on social media platforms like LinkedIn and Twitter for their insights and announcements.
• Enrolling in continuous education courses and workshops offered by professional bodies like the IEEE and SEMI.
• Collaborating with academic institutions on research projects or staying in touch with university research outputs.

Q8. Discuss your understanding of silicon wafer processing. (Manufacturing Process)

Silicon wafer processing is the series of steps used to transform raw silicon into a material suitable for integrated circuit fabrication. The process typically includes:

1. Purification of Silicon: The process starts with mining and purification of silicon to produce polysilicon, a highly pure form of silicon.
2. Crystal Growth: The purified silicon is melted in a crucible and a seed crystal is dipped into it. By slowly pulling the seed crystal and rotating it, a single crystal, or ingot, is formed.
3. Wafer Slicing: The ingot is then sliced into thin wafers using a diamond saw or a wire saw.
4. Surface Preparation: Wafers are polished to create a smooth, defect-free surface.
5. Doping: Adding impurities, or dopants, to modify the electrical properties of the silicon.
6. Oxidation: Silicon wafers are exposed to oxygen or steam at high temperatures to grow a layer of silicon dioxide on the surface.
7. Photolithography: A process where ultraviolet light is used to transfer a geometric pattern from a photomask to the wafer.
8. Etching: Removing layers of material from the wafer to create the desired features.
9. Deposition: Adding layers of materials to the wafer’s surface, such as metals for interconnections.
10. Planarization: Flattening the surface to prepare for subsequent lithography and etching steps.

Each step must be precisely controlled to ensure the quality and performance of the end product.

Q9. How would you approach debugging a new hardware issue? (Debugging & Problem Solving)

When approaching a new hardware issue, my strategy would include:

• Initial Analysis: Gather as much information as possible about the issue, including system logs, user reports, and specific failure modes.
• Reproduction of the Issue: Attempt to replicate the problem under controlled conditions to understand the circumstances that cause it.
• Isolation of the Problem: Use a divide-and-conquer approach to narrow down the root cause by systematically eliminating potential sources of the issue.
• Testing Hypotheses: Formulate hypotheses about the cause of the problem and test them through experiments and diagnostics.
• Utilizing Diagnostic Tools: Employ hardware diagnostic tools, such as oscilloscopes, multimeters, and logic analyzers, to gather data on electrical behavior.
• Consultation and Collaboration: Work with other team members and consult with subject matter experts to gain insights that might lead to a resolution.
• Documentation and Reporting: Keep detailed records of findings and report on progress regularly to stakeholders.

Q10. Can you walk us through your experience with Verilog or VHDL? (Hardware Description Languages)

I have extensive experience with both Verilog and VHDL throughout my career in digital design. Here are some highlights:

• Design and Simulation: I’ve created numerous modules and testbenches in Verilog and VHDL, simulating them to verify functionality before hardware synthesis.
• Synthesis and Timing Analysis: I’ve used these languages to synthesize designs onto FPGAs and ASICs, performing timing analysis to ensure design specifications were met.
• Debugging and Verification: In Verilog, I’ve employed SystemVerilog assertions and UVM methodologies for robust verification. With VHDL, I’ve used custom testbenches and waveform analysis.
• Code Optimization: I’ve optimized VHDL and Verilog code to improve performance, reduce resource utilization, and achieve better timing results.

Here’s a table summarizing my experience with specific projects:

Project	Language	Description	Outcome
IoT Device Controller	VHDL	Designed a custom microcontroller	Successfully deployed in production devices
High-speed Serializer	Verilog	Developed a 10 Gbps data serializer	Met all timing requirements
Cryptography Engine	Verilog	Implemented an AES encryption module	Passed NIST certification tests
Automotive Sensor Hub	VHDL	Created a sensor data aggregator	Enhanced vehicle sensor data processing

Working with these hardware description languages has been integral to my success in designing and verifying complex digital systems.

Q11. What are some challenges you might face when scaling down chip technology? (Semiconductor Scaling)

When scaling down chip technology, several challenges may arise:

• Physical Limitations: The smaller the components, the more they bump up against physical limits of the materials. Quantum tunneling and other quantum mechanical effects can affect performance and reliability.
• Heat Dissipation: Smaller components can mean higher power density, which leads to more heat generation. Efficiently dissipating this heat becomes a challenge.
• Manufacturing Precision: The smaller the technology node, the more precise the manufacturing process must be. This can increase costs and complexity.
• Signal Integrity: At smaller scales, maintaining signal integrity becomes challenging due to issues like cross-talk and electromagnetic interference.
• Design Complexity: As chips become more complex with smaller feature sizes, the design process requires more sophisticated tools and methodologies.
• Economic Viability: There is a significant cost associated with developing and equipping fabrication plants capable of producing smaller-scale technologies.

Q12. How do you ensure the reliability of your designs? (Design Reliability)

Ensuring the reliability of designs involves a multi-faceted approach:

• Component Selection: Choosing high-quality, tested components known for their reliability.
• Robust Design Practices: Implementing design principles that account for potential stress factors, including variations in voltage, temperature, and load conditions.
• Simulation and Analysis: Using sophisticated software to simulate different scenarios and analyze the behavior of the design under various conditions.
• Testing Protocols: Establishing comprehensive testing protocols to identify and rectify any reliability issues before the product release.
• Feedback Mechanisms: Incorporating feedback from testing phases to improve the design and using field data to make iterations on the design for future reliability.

Q13. Describe a time when you had to make a critical decision in a technical project. (Decision Making)

How to Answer:
When answering this question, focus on a scenario where your decision had a significant impact on the project. Describe the context, the options you considered, the decision you made, and the rationale behind it. Explain the outcome of your decision and what you learned from the experience.

My Answer:
In a previous project, we faced a critical decision point when one of our key suppliers was unable to provide a vital component due to an unforeseen shortage. We had to decide whether to delay the project to wait for the component or to redesign the affected part of the project using a different component that was more readily available.

After thorough analysis, I decided to proceed with the redesign, which involved some risks but allowed us to keep the project on schedule. We worked closely with the engineering team to ensure the new component met our specifications and did not compromise the overall performance of the product. This decision ultimately allowed us to deliver the project on time and maintain customer satisfaction, despite the additional design efforts required.

Q14. What methods do you use to test semiconductor devices? (Testing & Quality Assurance)

Testing semiconductor devices typically involves a range of methods to ensure quality and performance:

• Electrical Testing: Measuring parameters such as current, voltage, and resistance to check for electrical performance.
• Environmental Testing: Subjecting devices to extreme temperatures, humidity, and other environmental conditions to ensure stability.
• Lifetime Testing: Operating the device over extended periods to simulate lifespan and identify potential long-term failures.
• Functional Testing: Ensuring the device performs all intended functions correctly.
• Stress Testing: Applying stresses beyond normal operational levels to identify failure modes and improve robustness.

Test Type	Description	Purpose
Parametric Testing	Measures specific electrical parameters to ensure they meet design specifications	Verify design specification
Burn-In Testing	Operating at high temperatures to accelerate potential early failures	Identify and reduce early failures
System-Level Testing	Testing the device in its final application or system context	Ensure real-world functionality

Q15. How do you approach collaborative design work in a team setting? (Teamwork & Collaboration)

To approach collaborative design work in a team setting, one should consider the following strategies:

• Effective Communication: Always keep lines of communication open and clear to ensure everyone is on the same page.
• Clear Role Definition: Define everyone’s role clearly to ensure that tasks are distributed properly and everyone understands their responsibilities.
• Regular Meetings: Hold regular meetings to track progress, discuss challenges, and brainstorm solutions.
• Use of Collaboration Tools: Utilize collaboration tools like shared documents, version control systems, and project management software to keep everyone aligned.
• Receptive to Feedback: Be open to receiving and giving constructive feedback to continually improve the design and team dynamics.

By employing these strategies, collaborative design work can be more efficient, and the final product can benefit from the diverse expertise of the team members.

Q16. Explain the impact of thermal design power in CPUs. (Thermal Management)

Thermal Design Power (TDP) is a crucial specification in CPU design and represents the maximum amount of heat that a cooling system is required to dissipate under the maximum theoretical workload. Here’s how TDP impacts CPU performance:

• Heat and Performance: The heat generated by the CPU must be efficiently dissipated to maintain performance. If the CPU overheats, it may throttle its clock speed to reduce temperature, leading to reduced performance.
• Cooling Requirements: TDP informs the design and selection of appropriate cooling solutions, such as heatsinks and fans. A CPU with a higher TDP will generally require a more robust cooling system.
• Energy Consumption: TDP is often correlated with power consumption. CPUs with high TDP may consume more energy, which can be a concern for energy-efficient systems.

Q17. How do you balance performance with energy efficiency in processor design? (Performance vs. Efficiency)

Balancing performance with energy efficiency in processor design requires a multi-faceted approach:

• Dynamic Scaling: Implementing dynamic voltage and frequency scaling (DVFS) allows the processor to adjust its performance and power usage based on the current workload.
• Multi-Core Design: Distributing workloads across multiple cores can increase performance while keeping energy use in check, as cores can be powered down when not in use.
• Architecture Optimization: Designing processor architectures that maximize instruction per cycle (IPC) efficiency helps in achieving more work done for each unit of energy consumed.

Q18. What is your understanding of Moore’s Law in today’s context? (Industry Trends)

Moore’s Law, the observation that the number of transistors on a microchip doubles about every two years, has been a guiding principle for the semiconductor industry for decades. In today’s context:

• Limits of Miniaturization: As feature sizes approach physical limits, it’s becoming more challenging and expensive to maintain the pace of Moore’s Law.
• Alternative Approaches: The industry is exploring new materials, 3D architectures, and innovative techniques like chiplets to continue improving performance and energy efficiency.

Q19. Can you describe a situation where you had to troubleshoot a complex circuit issue? (Circuit Troubleshooting)

How to Answer:
When answering this question, describe your systematic approach to problem-solving, detailing how you isolated the issue, the tools and techniques used, and how you resolved the problem.

My Answer:
In my previous role, I encountered a complex issue where a circuit was unexpectedly resetting under load. I used an oscilloscope to trace the problem to voltage drops on the power supply line. By adding decoupling capacitors and improving the trace layout for power distribution, I resolved the instability.

Q20. How do you manage documentation for design specifications and revisions? (Documentation & Revision Control)

Managing documentation for design specifications and revisions involves:

1. Version Control: Utilizing version control systems like Git or Subversion to keep track of changes in design files.
2. Documentation Standards: Adhering to clear documentation standards and templates to ensure consistency.
3. Change Logs: Maintaining detailed change logs to track what was modified, why, and by whom.

Revision Table Example:

Revision	Date	Description	Author
1.0	2023-01-10	Initial release of the design specs.	J. Doe
1.1	2023-02-15	Updated power supply section.	A. Smith
2.0	2023-03-22	Complete redesign for efficiency.	B. Johnson
2.1	2023-04-05	Minor corrections in thermal management.	C. Rodriguez

This table maintains a clear history of each revision, who made the changes, and what was changed.

Q21. Discuss your experience with cross-functional teams in hardware development. (Interdepartmental Coordination)

How to Answer:
In your response, you should provide specific experiences where you’ve worked with cross-functional teams. Explain the dynamics of the team, your role, the challenges faced, and how you overcame those challenges to achieve the project goals. Highlight the importance of communication, collaboration, and understanding different perspectives.

My Answer:
In my career, I’ve had extensive experience working with cross-functional teams, especially in the context of hardware development. For instance, I’ve collaborated with teams composed of members from engineering, design, supply chain, quality assurance, and marketing departments.

• Engineering & Design: My role often involved coordinating efforts between engineering and design teams to ensure that product specifications were met while also considering manufacturability.
• Supply Chain: I worked closely with the supply chain department to ensure that we had the necessary components for prototyping and production.
• Quality Assurance: I also participated in joint efforts with the QA team to develop testing protocols and to address any issues that arose during the validation phase.
• Marketing: Lastly, I engaged with marketing to understand customer needs and ensure that the final product would satisfy market demands.

One particular challenge was aligning the different goals and timelines of each department. To overcome this, I established regular interdepartmental meetings, clear communication channels, and set mutual milestones. Ultimately, this cross-functional approach was crucial in several successful project launches.

Q22. How do you prioritize tasks in a project with tight deadlines? (Time Management)

How to Answer:
Discuss your strategy for task prioritization, mentioning any tools or methodologies you use. Explain how you assess task urgency and importance, and how you manage your time efficiently under pressure.

My Answer:
Prioritizing tasks in a project with tight deadlines requires a methodical approach:

• Assess the Urgency and Impact: First, I identify which tasks need immediate attention and which ones have the most significant impact on the project’s progress.
• Use the Eisenhower Matrix: I often use this matrix to categorize tasks into four quadrants based on urgency and importance.
• Delegate: Whenever possible, I delegate tasks that others can perform so that I can focus on high-impact work.
• Regular Review: I review my priorities regularly as project dynamics can change quickly, and a task that was low priority yesterday could become critical today.

This approach has helped me consistently meet project deadlines without compromising the quality of work.

Q23. Can you explain the role of L1, L2, and L3 cache in processor performance? (Cache Hierarchy)

In modern processors, the cache hierarchy is designed to improve performance by providing faster access to frequently used data. The L1, L2, and L3 caches are different levels of this hierarchy:

• L1 Cache: This is the smallest and fastest cache, directly incorporated into the processor’s cores. It stores the most immediately required data and instructions for the CPU, leading to lower latency and quicker access times.
• L2 Cache: Slightly larger and slower than L1, the L2 cache serves as a bridge between the fast L1 cache and the larger L3 cache. It holds data that has been recently accessed or that is likely to be accessed soon.
• L3 Cache: This is typically the largest and slowest of the three, shared among cores on the CPU. The L3 cache stores data that is less time-sensitive but still important for performance. It acts as a buffer between the RAM and the faster L1 and L2 caches.

The synergy between these three levels of caching is what allows for efficient data retrieval, minimizing the need to access the slower main memory and thus enhancing the overall performance of the processor.

Q24. Describe your experience with FPGAs in prototyping. (Prototyping & FPGA)

My experience with FPGAs (Field-Programmable Gate Arrays) in prototyping has been quite extensive. FPGAs have been crucial for testing out designs before committing to final production for several projects. Here are some of the highlights:

• Rapid Iteration: FPGAs have allowed me to iterate on hardware designs quickly. Changes in the logic can be programmed and tested in real-time without the need for physical modifications.
• Customization: I’ve leveraged the flexibility of FPGAs to tailor the hardware for specific applications, which is highly beneficial for proof-of-concept development.
• Troubleshooting: Debugging with FPGAs is more straightforward as they provide the ability to modify and monitor internal signals and processes.
• Cost-Effectiveness: They have helped reduce prototyping costs because the same FPGA can be reused across different projects.

Q25. How do you assess and manage risks in a hardware development project? (Risk Management)

How to Answer:
Discuss your approach to identifying potential risks, assessing their likelihood and impact, and strategies for mitigation. Mention any frameworks or tools you use for risk management.

My Answer:
Assessing and managing risks in a hardware development project is a critical aspect of project management. My approach involves several steps:

• Identify Risks: I begin by brainstorming potential risks, drawing on past experiences and involving the expertise of the team.
• Assess Risks: For each identified risk, I evaluate both the likelihood of occurrence and potential impact using a risk assessment matrix.

Here’s an example of a risk assessment matrix:

Risk	Likelihood	Impact	Priority	Mitigation Strategy
Supply chain disruption	Medium	High	High	Diversify suppliers
Component obsolescence	Low	Medium	Medium	Plan for alternatives
Firmware bugs	High	High	High	Implement rigorous testing
Regulatory changes	Low	High	Medium	Regularly review regulations

• Prioritize Risks: I prioritize risks based on their assessed impact and likelihood, focusing on those with the highest priority first.
• Mitigation Strategies: For each high-priority risk, I develop a mitigation strategy, which may involve contingency planning, risk transfer, avoidance, or acceptance.
• Monitor and Review: Risk management is an ongoing process. I regularly review the risk landscape and adjust strategies as needed.

This structured approach ensures that we are prepared for potential issues and can respond effectively to challenges as they arise in the hardware development lifecycle.

4. Tips for Preparation

Firstly, review AMD’s products and recent developments to understand their market positioning and technology focus. Familiarize yourself with the technical knowledge pertinent to the role you’re applying for, whether it’s ASIC design, hardware description languages, or power optimization techniques.

Secondly, practice explaining complex concepts in simple terms, as you might need to demonstrate this ability during your interview. Brush up on your soft skills, especially communication and teamwork, as collaborative dynamics are key in a company like AMD.

Lastly, prepare to discuss leadership or project management experiences, as scenarios or behavioral questions are common. Tailor your responses to highlight situations where your actions had a tangible impact, showcasing your decision-making and problem-solving abilities.

5. During & After the Interview

During the interview, present yourself confidently but remain humble. Pay attention to non-verbal cues and be concise with your answers. Interviewers often seek candidates who not only have technical expertise but also show passion and adaptability.

Avoid common missteps such as speaking negatively about previous employers or appearing disinterested. Remember, this is also your opportunity to assess whether AMD is the right fit for you. Prepare thoughtful questions about the team, projects, or company culture.

After the interview, send a personalized thank-you email to express your appreciation for the opportunity and restate your enthusiasm for the role. This can keep you top of mind for the interviewers.

Expect to hear back regarding next steps or feedback within a couple of weeks, but this can vary. If you haven’t heard back in that timeframe, it’s acceptable to send a polite follow-up email to inquire about your status.